IC Package 정보

 

 

 

Small Outline Plastic Packages (SOIC)
Quarter Size Outline Packages (QSOP)
Thin Shrink Small Outline Plastic Packages (TSSOP)
Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
Mini Small Outline Plastic Packages (MSOP)
Dual Flat No-Lead Plastic Package (DFN)
Optical Dual Flat No-Lead Plastic Package (ODFN)
Thin Dual Flat No-Lead Plastic Package (TDFN)
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
Ultra Thin Dual Flat No-Lead COL Plastic Package (UTDFN COL)
Extreme Thin Flat No-Lead Plastic Package (X2DFN, X2QFN)
Quad Flat No-Lead Plastic Package (QFN)
Quad Flat No-Lead Plastic Package with Top Exposed Pad (QFN-TEP)
Thin Quad Flat No-Lead Plastic Package (TQFN)
Ultra Thin Quad Flat No-Lead COL Plastic Package (UTQFN COL)
Small Outline Transistor Plastic Package (SOT)
Thin Small Outline Transistor Plastic Package (TSOT)
Small Outline Transistor Plastic Packages (SC70)
Shrink Small Outline Plastic Packages (SSOP)
Dual-In-Line Plastic Packages (PDIP)
Shrink Dual-In-Line Plastic Packages (SPDIP)
Power Small Outline Plastic Packages (PSOP)
Plastic Leaded Chip Carrier Packages (PLCC)
Metric Plastic Quad Flatpack Packages (MQFP)
Thin Micro Lead Frame Plastic Package (TMLFP)
Thin Plastic Quad Flatpack Packages (TQFP)
Low Plastic Quad Flatpack Packages (LQFP)
Low Plastic Quad Flatpack Exposed Pad Packages (LQFP-EP)
Low Quad Flatpack with Top Exposed Pad Packages (LQFP-TEP)
Thin Plastic Power Quad Flatpack Exposed Pad Packages (TQFP-TEP)
Single-In-Line Plastic Packages (SIP)
Ball Grid Array Packages (BGA)
Thin, Fine Pitch, Plastic Ball Grid Array Package (TFBGA)
Very Thin, Fine Pitch, Plastic Ball Grid Array Package (VFBGA)
High Density Array Packages (HDA)
Wafer Level Chip Scale Package (WLCSP)
ShellOP 3D Package